The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7067228 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 27, 2006

Filed:

Jun. 22, 2001
Applicants:

Noriyo Kimura, Hitachi, JP;

Tomoaki Aoki, Hitachi, JP;

Kenji Kamio, Hitachi, JP;

Masaki Endou, Hitachi, JP;

Inventors:

Noriyo Kimura, Hitachi, JP;

Tomoaki Aoki, Hitachi, JP;

Kenji Kamio, Hitachi, JP;

Masaki Endou, Hitachi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A photosensitive resin composition which comprises (A) a binder polymer, (B) a photopolymerizing compound having at least one ethylenic unsaturated bond in the molecule and (C) a photopolymerization initiator, wherein the binder polymer as component (A) comprises two or more binder polymers and/or has a dispersity of 2.5-6.0, and wherein the photopolymerizing compound as component (B) has in the molecule at least one ethylene glycol chain and at least one C-Calkylene glycol chain.


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Kimura, Noriyo. (2006). Photosensitive resin composition, photosensitive element employing it, resist pattern forming method, and printed wiring board fabrication method (U.S. Patent No. 7067228). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7067228

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