The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2006
Filed:
Oct. 18, 2002
Arthur Keigler, Wellesley, MA (US);
Harald Herchen, Los Altos, CA (US);
Vincent E. Burkhart, San Jose, CA (US);
Son N. Trinh, Cupertino, CA (US);
Arthur Keigler, Wellesley, MA (US);
Harald Herchen, Los Altos, CA (US);
Vincent E. Burkhart, San Jose, CA (US);
Son N. Trinh, Cupertino, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
An apparatus for securing a substrate in an electrochemical deposition system is provided. The apparatus generally includes a substrate support member adapted to receive the substrate and a thrust plate assembly adapted to exert a downward force on the substrate. For some embodiments, a first sealing member adapted to engage a plating surface of the substrate may be attached to the substrate support member. The apparatus may also include a second sealing member adapted to engage a non-plating surface of the substrate or a surface of the substrate support member to prevent the flow of plating fluid to a non-plating surface of the substrate. The apparatus may also include electrical contacts to electrically contact the plating or non-plating surface of the substrate.