The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2006
Filed:
Aug. 08, 2003
Michael J. Adams, Olmsted Falls, OH (US);
James Healy, Jr., Carnegie, PA (US);
William H. Howland, Jr., Wexford, PA (US);
Michael J. Adams, Olmsted Falls, OH (US);
James Healy, Jr., Carnegie, PA (US);
William H. Howland, Jr., Wexford, PA (US);
Solid State Measurements, Inc., Pittsburgh, PA (US);
Abstract
A method of processing a semiconductor wafer includes utilizing a heated gas to heat at least one part of a semiconductor wafer by convection whereupon at least one contaminant is desorbed therefrom. A stream of cooling gas is caused to pass over the one part of the semiconductor wafer in the absence of heated gas to cool the one part of the semiconductor wafer. A metrology tool is then caused to measure at least one part of the semiconductor wafer to determine at least one characteristic thereof.