The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2006
Filed:
Jul. 29, 2002
Toshimasa Sakayori, Tokyo, JP;
Kenichi Horie, Tokyo, JP;
Takashi Sugio, Tokyo, JP;
Takehito Miura, Tokyo, JP;
Yuichi Iwase, Tokyo, JP;
Yasunori Kijima, Tokyo, JP;
Toshimasa Sakayori, Tokyo, JP;
Kenichi Horie, Tokyo, JP;
Takashi Sugio, Tokyo, JP;
Takehito Miura, Tokyo, JP;
Yuichi Iwase, Tokyo, JP;
Yasunori Kijima, Tokyo, JP;
Three Bond Co., Ltd., Tokyo, JP;
Sony Corporation, Tokyo, JP;
Abstract
A method of laminating first and second members to each other includes the steps of applying a resin material to a plurality of regions on the laminating surface of at least one of the first and second members such that an air escape passage extending in a predetermined direction is formed; providing a laminating force to the first and second members along the extending direction of the air escape passage in a state where the first and second members are disposed with their laminating surfaces opposed to each other, so that air is expelled toward the outside through the air escape passage and the applied resin material is made to be continuous so as to form a thin film layer; and then laminating the first and second members to each other.