The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2006
Filed:
Feb. 18, 2003
Jalal Ashjaee, Cupertino, CA (US);
Boris Govzman, Sunnyvale, CA (US);
Bernard M. Frey, Livermore, CA (US);
Boguslaw A. Nagorski, San Jose, CA (US);
Douglas W. Young, Sunnyvale, CA (US);
Bulent M. Basol, Manhattan Beach, CA (US);
Homayoun Talieh, San Jose, CA (US);
Jalal Ashjaee, Cupertino, CA (US);
Boris Govzman, Sunnyvale, CA (US);
Bernard M. Frey, Livermore, CA (US);
Boguslaw A. Nagorski, San Jose, CA (US);
Douglas W. Young, Sunnyvale, CA (US);
Bulent M. Basol, Manhattan Beach, CA (US);
Homayoun Talieh, San Jose, CA (US);
ASM Nutool, Inc., Fremont, CA (US);
Abstract
An integrated process tool for chemical mechanical processing, cleaning and drying a semiconductor workpiece is provided. The integrated process tool includes a CMP module and a cleaning and drying module. After being processed, the workpiece is transported from the CMP module to the cleaning and drying module using a movable housing. In the cleaning and drying module, a cleaning mechanism is used to clean the workpiece while the workpiece is rotated and held by a support stucture of the movable housing. A drying mechanism of the cleaning and drying module picks up the workpiece from the moveable housing and spin dries it. Throughout the CMP process, cleaning and drying, the processed surface of the wafer faces down.