The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2006
Filed:
Jun. 29, 2004
Stefan Schneidewind, Moritzburg OT Reichenberg, DE;
Claus Dietrich, Thiendorf OT Sacka, DE;
Jörg Kiesewetter, Dresden, DE;
Stojan Kanev, Wiesenweg, DE;
Stefan Kreissig, Venusberg, DE;
Frank Fehrmann, Priestewitz OT Basslitz, DE;
Hans-jürgen Fleischer, Priestewitz, DE;
Stefan Schneidewind, Moritzburg OT Reichenberg, DE;
Claus Dietrich, Thiendorf OT Sacka, DE;
Jörg Kiesewetter, Dresden, DE;
Stojan Kanev, Wiesenweg, DE;
Stefan Kreissig, Venusberg, DE;
Frank Fehrmann, Priestewitz OT Basslitz, DE;
Hans-Jürgen Fleischer, Priestewitz, DE;
SUSS MicroTec Test Systems (GmbH), Dresden, DE;
Abstract
A method of contacting a contact area with the tip of a contact needle (contact tip) in a prober and the arrangement of such a prober, is based on the object of ensuring reliable contacting and direct observation of the establishment of the contact between the contact tip and the contact area when contacting contact pads of small dimensions. The prober substantially includes a base frame with a movement device including a clamping fixture for receiving a semiconductor wafer and also contact needles, which are arranged opposite the free surface of the semiconductor wafer. The contacting of the contact tips initially requires a horizontal positioning of the semiconductor wafer, so that the contact area and the contact tip are one above the other and at a distance from each other, and subsequently moving vertically in the direction of the contact tip, until a contact of the contact tips with the contact area is established. The object is achieved by the vertical movement of the semiconductor wafer until the end position is reached being directly observed in a horizontal direction of observation and, for this purpose, an observation device is arranged in such a way that the observation axis runs in the spacing above the free wafer surface.