The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2006
Filed:
Dec. 09, 2003
Hei Ming Shiu, Hong Kong, HK;
Wai Wong Chow, Hong Kong, HK;
Nan Xu, Tianjin, CN;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A method of packaging an integrated circuit die () includes the steps of forming an array of soft conductive balls () in a fixture () and flattening opposing sides of the balls. The flattened balls are then transferred from the fixture to a mold masking tape (). A first side of the IC die is attached to the balls with a die attach adhesive () and then wire bonding pads () on the die are electrically connected directly to respective balls with wires (). An encapsulant () is formed over the die, the electrical connections, and a top portion of the formed balls. The tape is removed and adjacent, encapsulated dice are separated via saw singulation. The result is an encapsulated IC having a bottom side with exposed balls.