The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2006
Filed:
Sep. 29, 2003
Applicant:
Shinichiro Takami, Aichi, JP;
Inventor:
Shinichiro Takami, Aichi, JP;
Assignee:
Fujimi Incorporated, Aichi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); C09G 1/04 (2006.01); B24B 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A polishing composition of the present invention, which is used in polishing the edge of a wafer for semiconductor devices, effectively suppresses remaining amounts of abrasives on the wafer. The polishing composition includes silicon dioxide, an alkaline compound, a water-soluble polymer, and water. The average primary particle diameter Dof the silicon dioxide is at least 40 nm. The ratio D/Dof the silicon dioxide is no more than 3.8. The value D/D/Dof the silicon dioxide is no more than 0.07.