The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2006
Filed:
Apr. 14, 2003
Yoichiro Ueda, Osaka, JP;
Masaru Ichihara, Ashiya, JP;
Daisuke Sato, Kadoma, JP;
Ken Takano, Takaishi, JP;
Yoichiro Ueda, Osaka, JP;
Masaru Ichihara, Ashiya, JP;
Daisuke Sato, Kadoma, JP;
Ken Takano, Takaishi, JP;
Abstract
In a mounting system where a chip component is mounted by a small component mounting apparatus on paste solder applied onto a board and the mounting state is inspected by a mounting inspection apparatus, and when the mounting inspection apparatus confirms that a chip component is not present, it is firstly confirmed whether or not a mounting trace of a chip component is present on solder, and a mounting nozzle is specified which has mounted a chip component found to be a missing component according to the confirmation result. Thereafter, the confirmation result is transmitted to a controller of the small component mounting apparatus. The controller selects and obtains coping information from a data base based on the confirmation result, and the information is shown on a display.