The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2006

Filed:

Nov. 18, 2003
Applicant:

Noboru Matsuda, Kanagawa, JP;

Inventor:

Noboru Matsuda, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 29/94 (2006.01); H01L 31/62 (2006.01); H01L 31/113 (2006.01); H01L 31/119 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device comprises: a first semiconductor layer of a first conductivity type; a second semiconductor layer of a second conductivity type; a trench; a thick gate insulating film; a thin gate insulating film; a gate electrode; and a semiconductor region of a second conductivity type. The second semiconductor layer is provided on the first semiconductor layer. The trench penetrates the second semiconductor layer and intrudes into the first semiconductor layer. The thick gate insulating film is provided on a inner wall of the trench below an upper surface of the first semiconductor layer. The thin gate insulating film is provided on the inner wall of the trench at a part upper than the thick gate insulating film. The gate electrode fills the trench. The semiconductor region of a second conductivity type is selectively formed to adjoin the trench and to project from a bottom surface of the second semiconductor layer into the first semiconductor layer.


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