The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2006
Filed:
Feb. 17, 2004
Tatsunari Mii, Tachikawa, JP;
Tatsunari Mii, Tachikawa, JP;
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Abstract
Bump formation method and wire bonding method including a step of forming a ball on the tip end of a wire that passes through a capillary and joining this ball to an electrode pad so as to make a press-bonded ball. In the next step, the capillary is raised and moved horizontally so that the bottom flat portion of the capillary faces the press-bonded ball. Then, the capillary is lowered and the press-bonded ball is pressed, thus forming a first bump. Next, the capillary is raised and moved horizontally in a direction that is opposite from the previous horizontal-direction, thus positioning the flat portion of the capillary to face the first bump. Then, the capillary is lowered, and the wire is bent and pressed against the surface of the first bump so as to form a second bump. The wire is then cut from the second bump.