The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2006
Filed:
Oct. 22, 2003
Michael Edward Barsky, Sherman Oaks, CA (US);
Michael Wojtowicz, Long Beach, CA (US);
Rajinder Randy Sandhu, Castaic, CA (US);
Michael Edward Barsky, Sherman Oaks, CA (US);
Michael Wojtowicz, Long Beach, CA (US);
Rajinder Randy Sandhu, Castaic, CA (US);
Northrop Grumman Corporation, Los Angeles, CA (US);
Abstract
Die of high aspect ratio formed in a hard wafer substrate are sawed out without requiring tape, obtaining high die yields. Preliminary to sawing the semiconductor die () from a sapphire wafer (), the wafer is joined () to a silicon carrier substrate () by a thermoplastic layer () forming a unitary sandwich-like assembly. Sawing the die from the wafer follows. The thermoplastic is removed, and the die may be removed individually () from the silicon carrier substrate. Thermoplastic produces a bond that holds the die in place against the shear force exerted by the saw and by the stream of coolant ().