The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2006
Filed:
Jun. 15, 2000
Yuji Okuda, Gifu, JP;
Naoyuki Jimbo, Gifu, JP;
Kazutaka Majima, Gifu, JP;
Masahiro Tsuji, Gifu, JP;
Hideki Takagi, Gifu, JP;
Shigeharu Ishikawa, Gifu, JP;
Hiroyuki Yasuda, Gifu, JP;
Yuji Okuda, Gifu, JP;
Naoyuki Jimbo, Gifu, JP;
Kazutaka Majima, Gifu, JP;
Masahiro Tsuji, Gifu, JP;
Hideki Takagi, Gifu, JP;
Shigeharu Ishikawa, Gifu, JP;
Hiroyuki Yasuda, Gifu, JP;
Ibiden Co., Ltd., Gifu, JP;
Abstract
A table for a wafer polishing apparatus having superior heat-resistant, anti-thermal-shock, and anti-abrasion characteristics and capable of increasing the diameter of a semiconductor wafer while improving the quality of the wafer. The table () includes a plurality of superimposed bases () each of which is formed of silicide ceramic or carbide ceramic. The bases () are joined together by an adhesive layer (). A fluid passage () is formed in a joining interface between the bases ().