The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 02, 2006

Filed:

Jul. 14, 2005
Applicants:

Hiroaki Tanaka, Kariya, JP;

Manabu Tomisaka, Nagoya, JP;

Inventors:

Hiroaki Tanaka, Kariya, JP;

Manabu Tomisaka, Nagoya, JP;

Assignee:

Denso Corporation, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 9/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

A pressure sensor includes a semiconductor substrate having a diaphragm in which an electrical circuit including a gauge resistance is formed, an insulation film provided on a surface of the semiconductor substrate, an Al film provided on the insulation film and electrically connected to the electrical circuit through a conductor hole of the insulation film, an Au film provided on the Al film through a Ti film, a first protective film which covers the Al film and has an opening portion from which a portion of the Au film is exposed. In the pressure sensor, a second protective film made of polyimideamide or polyimide covers at least the surface of the Au film exposed from the first protective film, and a vicinity of the opening portion of the first protective film. Therefore, corrosion resistance of the Al film can be prevented while the pressure sensor has a reduced component number.


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