The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2006

Filed:

Jul. 17, 1998
Applicants:

James T. Hurley, Pleasanton, CA (US);

Fedor A. Pletenev, Nizhny Novyorod R., RU;

Inventors:

James T. Hurley, Pleasanton, CA (US);

Fedor A. Pletenev, Nizhny Novyorod R., RU;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06T 15/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for implementing bump mapping is provided that is fast enough to be used with real time interactive graphics products. Computationally expensive color values are precalculated for a sample of normal vector orientations as a function of orientation-dependent color variables, collected in a color map, and referenced through the color variables. The color variables are linearly related to angle coordinates that specify the normal vector orientations in a selected coordinate system. Angle coordinates are determined for the vertices of the polygons representing the object to be imaged. During rendering, the vertex angle coordinates are interpolated to provide pixel angle coordinates. Modified angle coordinates are generated by combining the angle coordinates with angle perturbations provided by a perturbation source, and converted to color variables. Color values referenced by the color variables are assigned to the corresponding pixels.


Find Patent Forward Citations

Hurley, James. (2006). Extension of fast phong shading technique for bump mapping (U.S. Patent No. 7034827). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7034827

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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