The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2006
Filed:
May. 14, 2002
Klaus Lowack, Erlangen, DE;
Guenter Schmid, Hemhofen, DE;
Recai Sezi, Roettenbach, DE;
Ute Zschieschang, Erlangen, DE;
Klaus Lowack, Erlangen, DE;
Guenter Schmid, Hemhofen, DE;
Recai Sezi, Roettenbach, DE;
Ute Zschieschang, Erlangen, DE;
Infineon Technologies AG, Munich, DE;
Abstract
The present invention provides a process for wiring electrical contact sites, in particular on the surface of an electronic or microelectronic component, with the following steps: applying and patterning at least one dielectric on the component surface; currentlessly depositing a conductor starting layer for producing metal wiring interconnects and substitute contact sites with short-circuit contacts for interconnecting the individual metal wiring interconnects and the corresponding electrical contact sites; reinforcing the conductor starting layer by a common electrodepositing process; and separating the short-circuit contacts for separating the electrical contact sites or the contact sites of the wiring from one another.