The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2006
Filed:
Jun. 03, 2002
Shunichi Abe, Tokyo, JP;
Tetsuya Uebayashi, Tokyo, JP;
Naoki Izumi, Tokyo, JP;
Akira Yamazaki, Tokyo, JP;
Shunichi Abe, Tokyo, JP;
Tetsuya Uebayashi, Tokyo, JP;
Naoki Izumi, Tokyo, JP;
Akira Yamazaki, Tokyo, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A semiconductor chip, substrate employing plural bonding steps to ensure complete bonding particularly of peripheral edges. Embodiments include placing an adhesive layer on a chip mounting substrate positioned on a first supporting device, pressing a semiconductor chip against the chip mounting substrate to bond the semiconductor chip temporarily to the chip mounting substrate temporarily bonded chip on a second supporting device, and applying chip to straighten warpage and to bond the chip entirely to the chip mounting substrate.