The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2006

Filed:

Sep. 18, 2002
Applicants:

Tomonari Nakayama, Chiba, JP;

Masakazu Kato, Chiba, JP;

Takayasu Nihira, Chiba, JP;

Inventors:

Tomonari Nakayama, Chiba, JP;

Masakazu Kato, Chiba, JP;

Takayasu Nihira, Chiba, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/023 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention provides a positive photosensitive resin composition which is free from film reduction, swelling or peeling at the time of development with an aqueous alkaline solution and which provides a dimensionally stable patterns after curing, and of which the final cured film has a low water absorption and excellent alkaline resistance. A positive photosensitive polyimide resin composition characterized by comprising an organic solvent-soluble polyimide having repeating units represented by the formula (1):(wherein m is an integer of from 3 to 10,000, Ris a tetravalent organic group, Ris a bivalent organic group, provided that from 5 to 100 mol % of Ris a bivalent organic group having fluorine), a polyamic acid and a compound capable of generating an acid by irradiation with light.


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