The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2006
Filed:
Jun. 18, 2003
Angela Petroski, Crawfordsville, IN (US);
Richard D. Cooper, Sullivan, IN (US);
Paul Fathauer, Sullivan, IN (US);
David Perry, Crawfordsville, IN (US);
Angela Petroski, Crawfordsville, IN (US);
Richard D. Cooper, Sullivan, IN (US);
Paul Fathauer, Sullivan, IN (US);
David Perry, Crawfordsville, IN (US);
Raytech Innovative Solutions, LLC, Sullivan, IN (US);
Abstract
A composite polishing pad for use in chemical-mechanical planarization (CMP) processes, which polishing pad of the invention is made of a paper-making-process produced fibrous-matrix of paper-making fibers bound with resin material, and consists of a top section with one or more lower sections, where each layer has unique material properties. Polishing performance can be substantially improved by modifying the individual characteristics of each layer. Typically, the top layer or working surface will be of a higher modulus material than the lower layers. Therefore, the sub-layers may consist of lower density regions or a modified surface structure, such as grooving, to effectively modify the bulk modulus.