The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2006
Filed:
Jun. 16, 2004
Applicants:
Yam MO Wong, Singapore, SG;
Ka Shing Kenny Kwan, Singapore, SG;
Chong Hao Chen, Singapore, SG;
Inventors:
Assignee:
ASM Technology Singapore Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 37/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A bondhead is provided that comprises a bondhead body for holding a bonding tool, such as an ultrasonic transducer, and a bondhead actuator coupled to the bondhead body for moving the bonding tool with respect to a bonding surface. A wire clamping device, which may comprise a wire clamp holder and a wire clamp, is movable relative to the bondhead body for feeding a bonding wire to the bonding tool. A wire clamping device actuator is operative to move the wire clamping device relative to the bondhead body for improved control of the feeding of bonding wire to the bonding tool.