The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2006

Filed:

Mar. 21, 2005
Applicant:

Lianzhong Yu, Redmond, WA (US);

Inventor:

Lianzhong Yu, Redmond, WA (US);

Assignee:

Honeywell International, Inc., Morristown, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01P 15/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

Microelectromechanical system (MEMS) integrated micro devices and acceleration sensor devices formed of first and second silicon wafers that are permanently joined together in a composite silicon wafer having an array of first complete stand-alone three-dimensional micromechanical device features formed in the first silicon wafer, an array of second complete stand-alone three-dimensional micromechanical device features formed in the second silicon wafer, and one or more composite three-dimensional micromechanical device features formed of first partial three-dimensional micromechanical device features formed in the first silicon wafer that are permanently joined to cooperating second partial three-dimensional micromechanical device features formed in the second silicon wafer.


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