The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2006

Filed:

Nov. 15, 2002
Applicants:

Toshiya Teramae, Ebina, JP;

Junichi Saeki, Yokohama, JP;

Yasuharu Ichinose, Ryuo, JP;

Shuichi Suzuki, Ichikawadaimon, JP;

Inventors:

Toshiya Teramae, Ebina, JP;

Junichi Saeki, Yokohama, JP;

Yasuharu Ichinose, Ryuo, JP;

Shuichi Suzuki, Ichikawadaimon, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/861 (2006.01); H01L 29/88 (2006.01);
U.S. Cl.
CPC ...
Abstract

A small semiconductor package having two electrodes, which can be produced at reduced cost and which features high reliability. The package has a structure in which an anode and a cathode are arranged on one surface of a semiconductor chip, each electrode having a bump electrode for connecting the electrode to an external substrate. An insulating resin is provided on the surface of the semiconductor chip and on the surfaces of the bump electrodes, except at least for the connection portions to the external substrate.


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