The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2006
Filed:
Oct. 21, 2002
Alan D. Zdunek, Chicago, IL (US);
Alan D. Zdunek, Chicago, IL (US);
American Air Liquide, Inc., Fremont, CA (US);
Abstract
A microstructured electrode coupled with an analytical method designed to simulate the actual conditions on the wafer and to measure critical parameters such as mass transfer of the active plating components, deposition rates of the copper in the plating bath solutions, and/or additive concentration is disclosed. Thus, an offline method for process control is provided. Additionally, the electrode and method can be incorporated into a copper interconnect bath tool or copper interconnect bath distribution system for online control of the process chemistry. The microstructured electrode design consists of a patterned electrode surface that simulates the dimensions of the interconnects and vias. The analytical method can be any type of method that allows diffusion or kinetic information to be obtained, such as electrochemical impedance, electrochemical noise, and other voltammetric or galvanostatic methods.