The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2006
Filed:
Feb. 01, 2001
Takenori Hirose, Machida, JP;
Hiroyuki Kojima, Kawasaki, JP;
Mineo Nomoto, Yokohama, JP;
Susumu Aiuchi, Yokohama, JP;
Takenori Hirose, Machida, JP;
Hiroyuki Kojima, Kawasaki, JP;
Mineo Nomoto, Yokohama, JP;
Susumu Aiuchi, Yokohama, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
The object of the present invention is to establish a technology for directly evaluating polishing pad surface conditions, to allow high-precision CMP process management, and to improve process throughput. The pad surface is illuminated with light. The intensity of reflected light or fluorescence from the illuminated area or an intensity distribution image is used directly evaluate the pad surface condition. Based on the results of this evaluation, conditioning conditions for a conditioner are optimized, thus allowing high-precision CMP processing while maintaining good pad surface conditions.