The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2006
Filed:
Jun. 12, 2003
Masatoshi Kanamaru, Miho, JP;
Takanori Aono, Chiyoda, JP;
Tatsuya Nagata, Ishioka, JP;
Kenji Kawakami, Ryuo, JP;
Hideyuki Aoki, Takasaki, JP;
Masatoshi Kanamaru, Miho, JP;
Takanori Aono, Chiyoda, JP;
Tatsuya Nagata, Ishioka, JP;
Kenji Kawakami, Ryuo, JP;
Hideyuki Aoki, Takasaki, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A manufacturing method for improving the yield in a semiconductor manufacturing process and reducing the manufacturing cost produces a semiconductor device that is inexpensively manufactured and has a high reliability by reliably making contact during inspection with a suitable pressing force, while limiting damage to an electrode pad even when many inspected electrodes are inspected. A substrate used for inspection of the semiconductor device has a beam, a probe on the beam having a projecting shape for coming in contact with an electrode (electrode pad) of the semiconductor device, and a secondary electrode electrically connected to the probe through an electrically conductive member disposed on the side of the beam opposed to the side where the probe is provided. In an inspecting process, an inspecting device having a layer having many projections formed in the probe come in contact with the electrode pad of the semiconductor device.