The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2006
Filed:
Dec. 04, 2003
Byoung-jun Min, Chungcheongnam, KR;
Jeong-ho Bang, Kyungki-do, KR;
Hyun-seop Shim, Chungcheongnam, KR;
Hyo-geun Chae, Seoul, KR;
Byoung-jun Min, Chungcheongnam, KR;
Jeong-ho Bang, Kyungki-do, KR;
Hyun-seop Shim, Chungcheongnam, KR;
Hyo-geun Chae, Seoul, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A test kit for a semiconductor package and a method for testing the semiconductor package using the same are provided. The test kit for a semiconductor package includes a pick-and-place tool for picking up and loading/unloading the semiconductor package, a head assembly having a package guider and a socket guider, and a socket which is positioned under the head assembly. The socket guider performs a pre-alignment function for a correct operation of the package guider, before the package guider starts operating. The package guider aligns the semiconductor package.