The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2006
Filed:
May. 19, 2003
Applicants:
Young Hun Byun, Daejun-Shi, KR;
Soon Taik Hwang, Kyungki-Do, KR;
Byong Ki Yun, Daejun-Shi, KR;
Hae Jung Son, Kyoungki-Do, KR;
Inventors:
Young Hun Byun, Daejun-Shi, KR;
Soon Taik Hwang, Kyungki-Do, KR;
Byong Ki Yun, Daejun-Shi, KR;
Hae Jung Son, Kyoungki-Do, KR;
Assignee:
Samsung Electronics Co., Ltd., Kyungki-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
An organometallic precursor mixture for forming a metal alloy pattern and a method of forming the metal alloy pattern using the same, wherein the metal alloy pattern having improved adhesive force to a substrate, heat resistance, and resistance to atmospheric corrosion can be readily formed using the organometallic precursor mixture by and exposing step without using a separate photosensitive resin.