The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2006
Filed:
May. 30, 2002
Applicants:
Tro-hsu Lin, Taichung, TW;
Tien-chen HU, Pingtung, TW;
Hong-jin Pu, Pingtung, TW;
Zhi-zan Zhuang, Kaohsiung, TW;
Inventors:
Tro-Hsu Lin, Taichung, TW;
Tien-Chen Hu, Pingtung, TW;
Hong-Jin Pu, Pingtung, TW;
Zhi-Zan Zhuang, Kaohsiung, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
An electroplating anode including a substantially convex oxidizing surface for oxidation of metal atoms in a semiconductor wafer electroplating process. The electroplating anode of the present invention substantially prolongs the lifetime of the anode and contributes to the prevention of wafer contamination due to generation of potential wafer-contaminating precipitate particles during a wafer electroplating process.