The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2006
Filed:
Sep. 26, 2003
Jeanne P. Bickford, Essex Junction, VT (US);
Edward K. Evans, Essex Junction, VT (US);
Sean Horner, Burlington, VT (US);
Raymond J. Rosner, Colchester, VT (US);
Andrew Wienick, South Burlington, VT (US);
Joseph Yoder, Oakton, VA (US);
Jeanne P. Bickford, Essex Junction, VT (US);
Edward K. Evans, Essex Junction, VT (US);
Sean Horner, Burlington, VT (US);
Raymond J. Rosner, Colchester, VT (US);
Andrew Wienick, South Burlington, VT (US);
Joseph Yoder, Oakton, VA (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method and system for predicting manufacturing yield for a proposed integrated circuit The method includes: in the order recited: (a) providing a multiplicity of different integrated circuit library elements in a design database, each library element linked to a corresponding normalization factor in the design database; (b) selecting library elements from the design database to include in a proposed design for the integrated circuit; (c) generating an equivalent circuit count of the proposed design based on the normalization factors and a count of each different library element included in the proposed design; and (d) calculating a predicted manufacturing yield based on the equivalent circuit count, a predicted density of manufacturing defects and an area of the proposed integrated circuit chip.