The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2006
Filed:
Jul. 31, 2003
Applicants:
Masanobu Nogome, Bizen, JP;
Akiyoshi Tamura, Suita, JP;
Keiichi Murayama, Okayama, JP;
Kazutsune Miyanaga, Okayama, JP;
Yoshitaka Kuroishi, Bizen, JP;
Inventors:
Masanobu Nogome, Bizen, JP;
Akiyoshi Tamura, Suita, JP;
Keiichi Murayama, Okayama, JP;
Kazutsune Miyanaga, Okayama, JP;
Yoshitaka Kuroishi, Bizen, JP;
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device includes a substrate with a via hole. An electrode is formed on a surface of the substrate so that a portion of the electrode extends through the via hole. A photosensitive resin is formed over the surface so as to cover an aperture of the via hole.