The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2006
Filed:
Jul. 13, 2004
Michael Bauer, Nittendorf, DE;
Christian Birzer, Burglengenfeld, DE;
Georg Ernst, Thalmassing, DE;
Rainer Steiner, Regensburg, DE;
Hermann Vilsmeier, Regensburg, DE;
Holger Woerner, Regensburg, DE;
Michael Bauer, Nittendorf, DE;
Christian Birzer, Burglengenfeld, DE;
Georg Ernst, Thalmassing, DE;
Rainer Steiner, Regensburg, DE;
Hermann Vilsmeier, Regensburg, DE;
Holger Woerner, Regensburg, DE;
Infineon Technologies AG, Munich, DE;
Abstract
A semiconductor component with an electromagnetic shielding device against alpha radiation, beta radiation and high-frequency electromagnetic radiation is presented. The semiconductor component includes a semiconductor chip with a circuit integrated therein with a number of electrical terminal areas and at least one ground terminal area. The semiconductor also includes a package that contains the semiconductor chip and also a chip carrier. The chip carrier has a number of external electrical terminals and an external ground terminal. The electrical terminal areas and the ground terminal areas of the semiconductor chip are electrically connected to the external electrical terminals and the external ground terminals of the chip carrier by connecting means. The semiconductor chip and the connecting means are in this case encapsulated by an electrically insulating passivation. The semiconductor chip encapsulated in this way is in turn encapsulated with an electrically and thermally conductive plastics compound, which forms the package and is electrically connected to the ground terminal.