The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2006
Filed:
Feb. 24, 2000
Christopher J. DE Simone, Phoenix, AZ (US);
Lucian M. Hand, Bozeman, MT (US);
Gi Jeong Kim, Kuri, KR;
Seung MO Kim, Seoul, KR;
Jin an Lee, Kuri, KR;
Christopher J. de Simone, Phoenix, AZ (US);
Lucian M. Hand, Bozeman, MT (US);
Gi Jeong Kim, Kuri, KR;
Seung Mo Kim, Seoul, KR;
Jin An Lee, Kuri, KR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A semiconductor package having a fully encapsulated heat sink is disclosed, along with leadframes for making the package. A semiconductor chip is mounted on a surface of the heat sink. The heat sink is in an electrically insulative, thermally conductive connection with a plurality of leads that extend from a first end that overhangs the heat sink to an second end outside of the package body. A ring of a double sided adhesive tape attaches the heat sink to the overhanging portion of the leads. The heat sink design minimizes voids and damage caused by the encapsulation process, while maintaining thermal performance comparable to conventional, exposed heat sinks.