The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2006

Filed:

Jul. 30, 2004
Applicant:

Sheng-tsung Liu, Kaohsiung, TW;

Inventor:

Sheng-Tsung Liu, Kaohsiung, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A substrate with reinforced contact pad structure includes a metal wiring layer and a solder mask formed over its surface. The metal wiring layer includes at least a NSMD (Non-Solder Mask Defined) type contact pad, a trace and an extension. The extension connects the contact pad and the trace, and has an upper surface which is covered by the solder mask so as to enhance the connecting strength between the trace and the contact pad and to improve the position stability of the NSMD type contact pad on the substrate. In an embodiment, the contact pad is circular for bonding a bump or a solder ball. The first extension is fan-shaped. The extension also has a sidewall exposed out of the solder mask.


Find Patent Forward Citations

Liu, Sheng-Tsung. (2006). Substrate with reinforced contact pad structure (U.S. Patent No. 7005750). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7005750

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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