The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7005744 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 28, 2006

Filed:

Sep. 22, 2003
Applicants:

Xiangdong Chen, Poughquag, NY (US);

LI Wang, LaGrangeville, NY (US);

Inventors:

Xiangdong Chen, Poughquag, NY (US);

Li Wang, LaGrangeville, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/41 (2006.01); H01L 29/49 (2006.01);
U.S. Cl.
CPC ...
Abstract

A structure and method are provided for a conductor line stack of an integrated circuit. The conductor line stack includes a layer of a first material such as heavily doped polysilicon or a metal silicide. A layer of a second material such as a metal is formed over the layer of first material, the layer of second material having an upper portion and a lower portion. A pair of first spacers is disposed on sidewalls of the upper portion, wherein the lower portion has width defined by a combined width of the upper portion and the pair of first spacers. A pair of second spacers is formed on sidewalls of the first spacers, the lower portion and the layer of first material. The conductor line stack structure is well adapted for formation of a borderless bitline contact in contact therewith.


Find Patent Forward Citations

Chen, Xiangdong. (2006). Conductor line stack having a top portion of a second layer that is smaller than the bottom portion (U.S. Patent No. 7005744). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7005744

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