The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2006
Filed:
May. 05, 2003
Applicants:
Kang Rim Choi, Cupertino, CA (US);
Nathan Zommer, Los Altos, CA (US);
Inventors:
Kang Rim Choi, Cupertino, CA (US);
Nathan Zommer, Los Altos, CA (US);
Assignee:
IXYS Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A power device includes a semiconductor die having an upper surface and a lower surface. One or more terminals are coupled to the die. A first substrate is bonded to the upper surface of the die. The first substrate is configured to provide a first heat dissipation path. A second substrate is bonded to the lower surface of the die. The second substrate is configured to provide a second heat dissipation path.
Choi, Kang. (2006). Double-sided cooling isolated packaged power semiconductor device (U.S. Patent No. 7005734). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7005734
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile