The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2006
Filed:
Mar. 19, 2004
Chen-shien Chen, Hsin-Chu, TW;
Yai-yei Huang, Hsin-Chu, TW;
Yean-zhaw Chen, Tainan, TW;
Kai-hsiung Chen, Danshuei Township, Taipei County, TW;
Yih-shung Lin, Singapore, TW;
Chen-Shien Chen, Hsin-Chu, TW;
Yai-Yei Huang, Hsin-Chu, TW;
Yean-Zhaw Chen, Tainan, TW;
Kai-Hsiung Chen, Danshuei Township, Taipei County, TW;
Yih-Shung Lin, Singapore, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin Chu, TW;
Abstract
A one-time feedback CMP process control method which contributes to uniformity in the quantity of material removed from wafers in a lot during semiconductor processing and is suitable for complex processes such as STI (shallow trench isolation) fabrication procedures, is disclosed. The method includes providing a plurality of wafers having a set of pilot wafers and a set of remaining wafers, polishing each of the pilot wafers according to an original process time, determining a compensation time for the pilot wafers, determining an update time by adding the compensation time to the original process time and polishing the set of remaining wafers according to the update time.