The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2006

Filed:

Feb. 11, 2003
Applicants:

Wen-yan Chen, Hsinchu, TW;

Rong-chang Feng, Hsinchu, TW;

Chun-kai Liu, Taipei, TW;

Inventors:

Wen-Yan Chen, Hsinchu, TW;

Rong-Chang Feng, Hsinchu, TW;

Chun-Kai Liu, Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

The opto-electrical module packaging installs opto-electrical devices on a conductive leadframe to form an opto-electrical module. The opto-electrical module is then packaged using a molding packaging means, forming a transparent plastic base. The transparent plastic base is installed with a convergent lens to focus light. The leadframe has a plurality of pins and is mounted on the circuit board by soldering. This forms a packaging structure without bare pins exposed to the environment. In addition, the leadframe has a precision alignment structure extending outward as the alignment mechanism when assembled with a fiber connector. The precision packaging procedure provides a precision alignment of the converging lens and the opto-electrical devices at the same time.


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Chen, Wen-Yan. (2006). Opto-electrical module packaging (U.S. Patent No. 7004642). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7004642

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