The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2006

Filed:

Mar. 11, 2003
Applicants:

Christopher L. Chua, San Jose, CA (US);

Francesco Lemmi, Rome, IT;

Koenraad F. Van Schuylenbergh, Mountain View, CA (US);

Jeng Ping LU, Mountain View, CA (US);

David K. Fork, Los Altos, CA (US);

Eric Peeters, Fremont, CA (US);

Decai Sun, Sunnyvale, CA (US);

Donald L. Smith, Bolinas, CA (US);

Linda T. Romano, Sunnyvale, CA (US);

Inventors:

Christopher L. Chua, San Jose, CA (US);

Francesco Lemmi, Rome, IT;

Koenraad F. Van Schuylenbergh, Mountain View, CA (US);

Jeng Ping Lu, Mountain View, CA (US);

David K. Fork, Los Altos, CA (US);

Eric Peeters, Fremont, CA (US);

Decai Sun, Sunnyvale, CA (US);

Donald L. Smith, Bolinas, CA (US);

Linda T. Romano, Sunnyvale, CA (US);

Assignee:

Xerox Corporation, Stamford, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 43/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.


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