The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2006
Filed:
Jun. 27, 2002
Gregory J. Mccollum, Gibsonia, PA (US);
Thomas C. Moriarity, Allison Park, PA (US);
Kevin C. Olson, Wexford, PA (US);
Michael G. Sandala, Pittsburgh, PA (US);
Alan E. Wang, Gibsonia, PA (US);
Steven R. Zawacky, Pittsburgh, PA (US);
Gregory J. McCollum, Gibsonia, PA (US);
Thomas C. Moriarity, Allison Park, PA (US);
Kevin C. Olson, Wexford, PA (US);
Michael G. Sandala, Pittsburgh, PA (US);
Alan E. Wang, Gibsonia, PA (US);
Steven R. Zawacky, Pittsburgh, PA (US);
PPG Industries Ohio, Inc., Cleveland, OH (US);
Abstract
Provided is a process for forming metallized vias in a substrate including the steps of (I) applying to an electroconductive substrate an electrodepositable coating composition onto all exposed surfaces of the substrate to form a conformal dielectric coating; (II) ablating a surface of the dielectric coating to expose a section of the substrate; (III) applying a layer of metal to all surfaces to form metallized vias in the substrate. Also disclosed are processes for fabricating a circuit assembly which include the application of an electrodoepositable coating composition onto exposed surfaces of the substrate/core to form a conformal dielectric coating thereon. The electrodepositable coating composition includes a resinous phase dispersed in an aqueous phase, where the resinous phase has a covalently bonded halogen content of at least 1 percent by weight. The dielectric coating derived therefrom has a low dielectric constant and low dielectric loss factor.