The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2006
Filed:
Nov. 29, 2002
Applicants:
Shinji Arai, Yamanashi, JP;
Takamasa Chikuma, Yamanashi, JP;
Masahiro Mochizuki, Yamanashi, JP;
Inventors:
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of processing a semiconductor wafer including the steps of executing a permutation processing by using a plurality of processing containers while sequentially transferring the wafers into the containers or performing a parallel processing and a transfer mechanism used commonly for the containers while sequentially transferring the wafers. The wafer processing is performed after the completion of conditioning of the vessel, and a conditioning start time for a next container is adjusted so that the completion of conditioning occurs when processing in the previous container is completed.