The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2006
Filed:
Mar. 31, 2005
Applicants:
Kiat Seng Yeo, Singapore, SG;
Hai Peng Ian, Singapore, SG;
Jiangud MA, Singapore, SG;
Manh Anh DO, Singapore, SG;
Johnny Kok Wai Chew, Singapore, SG;
Inventors:
Kiat Seng Yeo, Singapore, SG;
Hai Peng Ian, Singapore, SG;
Jiangud Ma, Singapore, SG;
Manh Anh Do, Singapore, SG;
Johnny Kok Wai Chew, Singapore, SG;
Assignee:
Chartered Semiconductor Manufacturing Ltd., Singapore, SG;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of fabricating an inductor using bonding techniques in the manufacture of integrated circuits is described. Bonding pads are provided over a semiconductor substrate. Input/output connections are made to at least two of the bonding pads. A plurality of wire bond loops are made between each two of the bonding pads wherein the plurality of wire bond loops forms the inductor.