The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2006
Filed:
Sep. 09, 2003
Daisuke Ito, Nagano, JP;
Daisuke Ito, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
A method of forming a conductor wiring pattern comprises: forming a first insulating layer on a surface of a semiconductor wafer and also forming a second, photosensitive insulating resin layer thereon; light-exposing and developing the second insulating layer to form pattern grooves so that the first insulating layer is exposed at bottoms of the pattern grooves; forming a plating seed layer on the second insulating layer including inner surfaces of the pattern grooves and then forming a resist pattern on the seed layer except for portions of the pattern grooves; filling the pattern grooves with a conductor by an electrolytic plating using the seed layer as a power supply layer; and removing the resist pattern and also removing the seed layer exposed on the surface of the second insulating layer to form a wiring pattern consisting of conductors remaining in the pattern grooves.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile