The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2006
Filed:
Jul. 24, 2002
Hiroji Aga, Annaka, JP;
Hiroyuki Takahashi, Chikuma, JP;
Kiyoshi Mitani, Annaka, JP;
Shin-Etsu Handotai Co., Ltd., Tokyo, JP;
Abstract
In the process of fabricating an SOI wafer based on the Smart Cut® Process, a stackof an SOI waferand a residual waferare separated into the individual wafers using a wafer separation jigof this invention. The wafer separation jigcomprises a supporting planeon which the stackis supported in the thickness-wise direction, and a stepped portiondisposed on the supporting plane, and having a height adjusted so as to stop movement-by-sliding of the lower wafer of the stack, but so as to allow movement-by-sliding of the upper wafer relative to the lower wafer. Both wafers are separated from each other by inclining the supporting planewith the stackplaced thereon, so as to allow the upper wafer to move by sliding as being driven by its own weight in the in-plane direction relative to the lower wafer. This method is successful in effectively suppressing friction between the wafers, and thus in preventing the wafer surface from being scratched.