The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2006
Filed:
May. 18, 2004
Sanjeev Aggarwal, Plano, TX (US);
Lindsey Hall, Plano, TX (US);
Trace Q. Hurd, Plano, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
The present invention provides, in one embodiment, a method of forming a copper layer () over a semiconductor substrate (). The method comprises coating a copper seed layer () located over a semiconductor substrate with a protective agent () to form a protective layer (). The method also includes placing the semiconductor substrate in an acid bath () to remove the protective layer. The method further includes electrochemically depositing a second copper layer () on the copper seed layer. Such methods and resulting conductive structures thereof may be advantageously used in methods to manufacture integrated circuits comprising copper interconnects.