The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2006

Filed:

Nov. 26, 2002
Applicants:

Timothy G. Dunham, South Burlington, VT (US);

Ezra D. B. Hall, Colchester, VT (US);

Howard S. Landis, Underhill, VT (US);

Mark A. Lavin, Katonah, NY (US);

William C. Leipold, Enosburg Falls, VT (US);

Inventors:

Timothy G. Dunham, South Burlington, VT (US);

Ezra D. B. Hall, Colchester, VT (US);

Howard S. Landis, Underhill, VT (US);

Mark A. Lavin, Katonah, NY (US);

William C. Leipold, Enosburg Falls, VT (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

An interconnect structure for use in semiconductor devices which interconnects a plurality of dissimilar metal wiring layers, which are connected vias, by incorporating shaped voids in the metal layers. The invention also discloses a method by which such structures are constructed.


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