The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2006

Filed:

Sep. 11, 2003
Applicants:

Shigeki Maekawa, Tokyo, JP;

Yoshihiro Kashiba, Tokyo, JP;

Inventors:

Shigeki Maekawa, Tokyo, JP;

Yoshihiro Kashiba, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

Probesfor testing and outer connecting terminalsare electrically connected to a test socket for semiconductor devices. In use of a connecting sheet, fabricated by an elastically deformative insulating member and electrodes, flexibility is given, and good electrical contacts are obtainable. Further, because the connecting sheetis exchangeable, contacting capability is recovered by exchange when solder debris is adhered and deposited to increase contact resistances. Accordingly, even though there is scattering of the heights of the outer connecting terminals, good electrical contact with the probes is obtainable, and even though the solder debris of the outer connecting terminals is adhered and deposited as a result of repeated usage, tests can be continuously conducted, wherein the test socket for semiconductor devices has good maintenance capability.


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