The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2006
Filed:
Apr. 10, 2003
Kazuki Kobayashi, Izumi, JP;
Ikuo Sakono, Soraku-gun, JP;
Shinji Shiraki, Tokyo, JP;
Hirofumi Sasaki, Tokyo, JP;
Kazuaki Niwa, Tokyo, JP;
Kazuki Kobayashi, Izumi, JP;
Ikuo Sakono, Soraku-gun, JP;
Shinji Shiraki, Tokyo, JP;
Hirofumi Sasaki, Tokyo, JP;
Kazuaki Niwa, Tokyo, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
JSR Corporation, Tokyo, JP;
Abstract
The invention provides a radiation-sensitive resin composition, by which a patterned insulation film whose water repellency varies is easily formed with high precision, a process for forming a patterned insulation film using this composition, a display element and an flat-panel disply device using the composition, and a process for producing the flat-panel disply device. The resin composition comprises (A) an alkali-soluble copolymer, (B) a 1,2-quinonediazide compound and (C) a water-repellent siloxane resin in particular proportions. In the production process of the patterned insulation film, patterning exposure and development are conducted on a coating formed of the resin composition. The display element and flat-panel disply device are equipped with an interlayer insulation film formed by the resin composition. The production process of the flat-panel disply device comprises an interlayer insulation film-forming step including a treatment of patterning exposure exposing conductor layer-forming regions in an exposure that only surface layer portions are cured in one part thereof, and the whole in the thickness-wise direction thereof is cured in the other parts, and a conductor layer-forming step of forming conductor layers on the surface of the interlayer insulation film with a liquid material.