The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2006
Filed:
Aug. 30, 2001
Ralf Preu, Freiburg, DE;
Eric Schneiderlöchner, Freiburg, DE;
Stefan Glunz, Freiburg, DE;
Ralf Lüdeman, Freiburg, DE;
Ralf Preu, Freiburg, DE;
Eric Schneiderlöchner, Freiburg, DE;
Stefan Glunz, Freiburg, DE;
Ralf Lüdeman, Freiburg, DE;
Abstract
A method of electrically contacting a semiconductor layer () coated with at least one dielectic layer () which is coated with a metal layer the metal layer () is applied on the dielectric layer () and the metal layer () is temporarily locally heated in a line, linear or dotted pattern by means of a source of radiation () in a controlled manner in such a way that a local molten mixture, is formed consisting exclusively of the metal layer (), the dielectric layer () and the semiconductor layer () are located directly underneath the metal layer () and upon solidification, leads to an electrical contact between the semiconductor layer () and the metal layer ().