The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2006
Filed:
Dec. 30, 1999
Applicants:
Nagesh Vodrahalli, Cupertino, CA (US);
Biswajit Sur, San Jose, CA (US);
Inventors:
Nagesh Vodrahalli, Cupertino, CA (US);
Biswajit Sur, San Jose, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01C 21/44 (2006.01); H05B 6/64 (2006.01); H05B 6/70 (2006.01); H05B 6/50 (2006.01); H01L 23/495 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package which has a thermal epoxy that can be attached to an integrated circuit and a thermal element. The thermal epoxy can be cured with energy at a microwave frequency. Curing the thermal epoxy with microwave energy can minimize package warpage during the curing process.