The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2005
Filed:
Mar. 01, 2002
Toshiyuki Arai, Machida, JP;
Ryousei Kawai, Kodaira, JP;
Hirofumi Tsuchiyama, Hitachinaka, JP;
Fumiyuki Kanai, Nishitokyo, JP;
Shinichi Nakabayashi, Hitachinaka, JP;
Toshiyuki Arai, Machida, JP;
Ryousei Kawai, Kodaira, JP;
Hirofumi Tsuchiyama, Hitachinaka, JP;
Fumiyuki Kanai, Nishitokyo, JP;
Shinichi Nakabayashi, Hitachinaka, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A method of fabrication of a semiconductor integrated circuit device, including polishing the entire area of an edge of a wafer, for example, uses three polishing drums in which a polishing drum polishes the upper surface of the edge of the water, a polishing drum polishes the central portion of the edge of the wafer and a polishing drum polishes the lower surface of the edges of the wafer, thereby preventing occurrence of obstacles which cause defoliation of thin films on the edge of the wafer.